AMD XCV400E-6BG560I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,874.90 | Dhs. 355,874.90 |
| 15+ | Dhs. 344,636.75 | Dhs. 5,169,551.25 |
| 25+ | Dhs. 337,144.64 | Dhs. 8,428,616.00 |
| 50+ | Dhs. 318,414.39 | Dhs. 15,920,719.50 |
| 100+ | Dhs. 280,953.87 | Dhs. 28,095,387.00 |
| N+ | Dhs. 56,190.77 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Virtex®-E |
| Packaging | | Tray |
| Number of LABs/CLBs | 2400 |
| Number of Logic Elements/Cells | 10800 |
| Total RAM Bits | 163840 |
| Number of I/O | 404 |
| Number of Gates | 569952 |
| Voltage - Supply | 1.71V ~ 1.89V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 560-LBGA Exposed Pad, Metal |
| Supplier Device Package | 560-MBGA (42.5x42.5) |
AMD Virtex-E FPGA XCV400E-6BG560I - High-Performance Field Programmable Gate Array
The XCV400E-6BG560I is a premium-grade Field Programmable Gate Array from AMD's renowned Virtex®-E series, engineered for mission-critical applications requiring exceptional processing power and reliability. This industrial-grade FPGA delivers outstanding performance with 569,952 gates and 404 I/O pins, making it ideal for aerospace, telecommunications, industrial automation, and embedded systems.
Key Features & Benefits
- High Logic Density: 10,800 logic elements across 2,400 LABs/CLBs provide extensive design flexibility
- Generous Memory: 163,840 total RAM bits for complex data processing and buffering
- Extensive I/O Capability: 404 I/O pins enable robust connectivity for multi-interface designs
- Industrial Temperature Range: Operates reliably from -40°C to 100°C (TJ) for harsh environments
- Precision Power Supply: 1.71V ~ 1.89V voltage range ensures stable, efficient operation
- Professional Packaging: 560-MBGA (42.5x42.5mm) with exposed pad for superior thermal management
Applications
This Virtex-E FPGA excels in demanding applications including digital signal processing, high-speed communications, industrial control systems, medical imaging equipment, and aerospace instrumentation. The surface mount design facilitates automated assembly for high-volume production.
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XCV400E-6BG560I.pdf