AMD XCVC1502-1LSINSVG1369
Normaler Preis
Dhs. 74,037.15
Normaler Preis
Dhs. 77,933.82
Verkaufspreis
Dhs. 74,037.15
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 74,037.15 | Dhs. 74,037.15 |
| 15+ | Dhs. 71,699.11 | Dhs. 1,075,486.65 |
| 25+ | Dhs. 70,140.44 | Dhs. 1,753,511.00 |
| 50+ | Dhs. 66,243.75 | Dhs. 3,312,187.50 |
| 100+ | Dhs. 58,450.37 | Dhs. 5,845,037.00 |
| N+ | Dhs. 11,690.07 | Price Inquiry |
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AMD Versal™ AI Core XCVC1502-1LSINSVG1369 FPGA System-on-Chip
The XCVC1502-1LSINSVG1369 is a high-performance FPGA System-on-Chip from AMD's Versal™ AI Core series, engineered for demanding industrial, automotive, aerospace, communications, and edge computing applications. This advanced SoC combines adaptive FPGA fabric with powerful ARM processing cores to deliver exceptional performance and flexibility.
Key Features
- Dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ running at 1GHz for high-performance application processing
- Dual ARM® Cortex™-R5F real-time processors with CoreSight™ at 400MHz for deterministic control tasks
- 80,000 logic cells of Versal™ Prime FPGA fabric for custom hardware acceleration
- Industrial temperature range: -40°C to 100°C (TJ) for harsh environment deployment
- Rich connectivity: CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART/USART, MMC/SD/SDIO
- High-speed peripherals: DDR memory controller, DMA, PCIe for data-intensive applications
- Compact 1369-FCBGA package (35x35mm) for space-constrained designs
Ideal Applications
- Industrial automation and control systems
- Automotive ADAS and autonomous driving platforms
- Aerospace and defense embedded systems
- 5G/6G wireless infrastructure and communications
- Edge AI inference and machine learning acceleration
- High-performance embedded vision processing
Authenticity Guaranteed: All products are sourced directly from authorized distributors and come with full manufacturer traceability and documentation.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ Prime FPGA, 80k Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |
XCVC1502-1LSINSVG1369.pdf
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