AMD XCVC1502-1MSINSVG1369
Normaler Preis
Dhs. 61,693.44
Normaler Preis
Dhs. 64,940.46
Verkaufspreis
Dhs. 61,693.44
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 61,693.44 | Dhs. 61,693.44 |
| 15+ | Dhs. 59,745.22 | Dhs. 896,178.30 |
| 25+ | Dhs. 58,446.41 | Dhs. 1,461,160.25 |
| 50+ | Dhs. 55,199.39 | Dhs. 2,759,969.50 |
| 100+ | Dhs. 48,705.35 | Dhs. 4,870,535.00 |
| N+ | Dhs. 9,741.07 | Price Inquiry |
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AMD Versal AI Core FPGA - XCVC1502-1MSINSVG1369
The AMD XCVC1502-1MSINSVG1369 is a high-performance Versal™ AI Core FPGA featuring 800,000 logic cells and advanced processing capabilities. This industrial-grade System-on-Chip (SoC) combines FPGA fabric with dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors with CoreSight™ debug technology, delivering exceptional computational power for demanding aerospace, automotive, industrial, and telecommunications applications.
Key Features & Benefits
- Massive Logic Capacity: 800k logic cells provide extensive resources for complex FPGA designs and AI acceleration
- Dual Processing Architecture: ARM Cortex-A72 (1.3GHz) for high-performance computing and Cortex-R5F (600MHz) for real-time control
- Advanced Connectivity: Integrated PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I2C, UART/USART, and MMC/SD/SDIO interfaces
- Industrial Temperature Range: Operates reliably from -40°C to 110°C (junction temperature) for harsh environments
- Compact High-Density Package: 1369-pin FCBGA (35x35mm) for space-constrained designs
- RoHS Compliant: Environmentally friendly and meets global regulatory standards
Ideal Applications
Perfect for AI/ML inference acceleration, 5G wireless infrastructure, advanced driver assistance systems (ADAS), industrial automation, aerospace & defense systems, high-speed data acquisition, and edge computing platforms requiring adaptive hardware acceleration.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ AI Core FPGA, 800k Logic Cells |
| Operating Temperature | -40°C ~ 110°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |
| ROHS |  |
XCVC1502-1MSINSVG1369.pdf
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