AMD XCVC1702-1LLIVSVA2197

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Normaler Preis Dhs. 132,405.57
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AMD Versal™ AI Core XCVC1702-1LLIVSVA2197 FPGA

High-performance System-on-Chip (SoC) FPGA combining adaptive computing with embedded processing for industrial, automotive, aerospace, communications, and edge computing applications.

Key Features

  • 1 Million Logic Cells - Extensive programmable fabric for complex designs
  • Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ - High-performance application processing at 1GHz
  • Dual ARM® Cortex™-R5F with CoreSight™ - Real-time processing at 400MHz
  • Advanced Connectivity - DDR, DMA, PCIe, Ethernet, CANbus, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ)
  • Compact 2197-FCBGA Package - 45x45mm form factor for space-constrained designs

Applications

Ideal for AI/ML acceleration, 5G wireless infrastructure, automotive ADAS systems, aerospace avionics, industrial automation, edge computing platforms, and high-speed data acquisition systems requiring adaptive hardware acceleration.

Authenticity Guaranteed - All components sourced directly from authorized distributors with full traceability and manufacturer documentation.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)