AMD XCVC1702-1LSEVSVA2197

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Normaler Preis Dhs. 88,268.89
Normaler Preis Dhs. 92,914.61 Verkaufspreis Dhs. 88,268.89
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AMD Versal™ AI Core XCVC1702-1LSEVSVA2197 FPGA

The XCVC1702-1LSEVSVA2197 is a high-performance System-on-Chip (SoC) FPGA from AMD's Versal™ AI Core series, engineered for demanding applications in aerospace, automotive, industrial automation, communications infrastructure, and edge computing environments.

Key Features

  • 1 Million Logic Cells - Massive programmable fabric for complex digital designs
  • Dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ debug (1GHz)
  • Dual ARM® Cortex™-R5F real-time processors with CoreSight™ (400MHz)
  • Advanced Connectivity - DDR, DMA, PCIe, Ethernet, CANbus, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial Temperature Range - 0°C to 100°C (TJ) for harsh environments
  • Compact 2197-FCBGA Package (45mm x 45mm) for space-constrained designs

Ideal Applications

This Versal AI Core FPGA is perfectly suited for:

  • Aerospace & defense systems requiring high reliability
  • Automotive ADAS and autonomous driving platforms
  • 5G/6G wireless infrastructure and baseband processing
  • Industrial automation and machine vision
  • Edge AI inference and data center acceleration
  • High-speed data acquisition and signal processing

Authenticity Guaranteed - All AMD Versal FPGAs are sourced directly from authorized distributors with full traceability and manufacturer warranty support.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)