AMD XCVC1702-1LSINSVG1369
Normaler Preis
Dhs. 89,906.06
Normaler Preis
Dhs. 94,637.94
Verkaufspreis
Dhs. 89,906.06
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 89,906.06 | Dhs. 89,906.06 |
| 15+ | Dhs. 87,066.90 | Dhs. 1,306,003.50 |
| 25+ | Dhs. 85,174.15 | Dhs. 2,129,353.75 |
| 50+ | Dhs. 80,442.25 | Dhs. 4,022,112.50 |
| 100+ | Dhs. 70,978.46 | Dhs. 7,097,846.00 |
| N+ | Dhs. 14,195.69 | Price Inquiry |
Versand wird beim Checkout berechnet
Request Quote / Inquiry
AMD Versal™ AI Core XCVC1702-1LSINSVG1369 FPGA
The AMD Versal AI Core XCVC1702-1LSINSVG1369 is a high-performance System-on-Chip (SoC) FPGA designed for demanding industrial, automotive, aerospace, communications, and edge computing applications. This advanced FPGA combines adaptive hardware acceleration with powerful embedded processing capabilities.
Key Features
- 1 Million Logic Cells - Massive programmable logic capacity for complex designs
- Dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ running at 1GHz
- Dual ARM® Cortex™-R5F real-time processors with CoreSight™ at 400MHz
- Advanced Connectivity - DDR, DMA, PCIe, CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
- Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ)
- Compact 1369-FCBGA Package (35x35mm) for space-constrained designs
Applications
Ideal for high-performance embedded systems requiring adaptive acceleration, real-time processing, and extensive I/O connectivity. Perfect for industrial automation, automotive ADAS, aerospace avionics, 5G communications infrastructure, and AI/ML edge computing deployments.
All specifications are subject to change. Please refer to the official AMD datasheet for complete technical details and ordering information.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |
XCVC1702-1LSINSVG1369.pdf
×