AMD XCVC1702-1MLINSVG1369
Normaler Preis
Dhs. 89,902.14
Normaler Preis
Dhs. 94,633.82
Verkaufspreis
Dhs. 89,902.14
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 89,902.14 | Dhs. 89,902.14 |
| 15+ | Dhs. 87,063.11 | Dhs. 1,305,946.65 |
| 25+ | Dhs. 85,170.44 | Dhs. 2,129,261.00 |
| 50+ | Dhs. 80,438.75 | Dhs. 4,021,937.50 |
| 100+ | Dhs. 70,975.37 | Dhs. 7,097,537.00 |
| N+ | Dhs. 14,195.07 | Price Inquiry |
Versand wird beim Checkout berechnet
Request Quote / Inquiry
AMD Versal™ AI Core FPGA - XCVC1702-1MLINSVG1369
The AMD XCVC1702-1MLINSVG1369 is a high-performance Versal™ AI Core FPGA featuring 1 million logic cells and dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™, delivering exceptional processing power for demanding aerospace, automotive, industrial, telecommunications, and medical applications.
Key Features & Benefits
- Advanced Processing Architecture: Dual ARM® Cortex®-A72 MPCore™ (1.3GHz) and dual ARM® Cortex™-R5F (600MHz) with CoreSight™ for real-time debugging and trace capabilities
- High-Density Logic: 1 million logic cells provide extensive programmable resources for complex system designs
- Robust Memory: 256KB integrated RAM for efficient data processing and buffering
- Comprehensive Connectivity: CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG support for versatile system integration
- High-Speed Peripherals: DDR memory interface, DMA, and PCIe for maximum data throughput
- Industrial-Grade Reliability: Extended operating temperature range (-40°C to 110°C TJ) ensures reliable performance in harsh environments
- Compact Package: 1369-FCBGA (35x35mm) footprint optimizes board space utilization
- RoHS Compliant: Meets environmental standards for global deployment
Ideal Applications
Perfect for aerospace systems, automotive electronics, industrial automation, telecommunications infrastructure, medical devices, and high-performance embedded computing where reliability, processing power, and long lifecycle support are critical.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | -40°C ~ 110°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |
| ROHS |  |
XCVC1702-1MLINSVG1369.pdf
×