AMD XCVC1702-1MSEVSVA2197
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 73,560.08 | Dhs. 73,560.08 |
| 15+ | Dhs. 71,237.12 | Dhs. 1,068,556.80 |
| 25+ | Dhs. 69,688.49 | Dhs. 1,742,212.25 |
| 50+ | Dhs. 65,816.90 | Dhs. 3,290,845.00 |
| 100+ | Dhs. 58,073.74 | Dhs. 5,807,374.00 |
| N+ | Dhs. 11,614.75 | Price Inquiry |
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AMD Versal™ AI Core FPGA - XCVC1702-1MSEVSVA2197
The AMD XCVC1702-1MSEVSVA2197 represents the pinnacle of adaptive compute acceleration, combining high-performance scalar processing engines, adaptable hardware engines, and intelligent AI engines with leading-edge memory and interfacing technologies. This Versal™ AI Core FPGA delivers 1 million logic cells of programmable logic resources, making it ideal for mission-critical applications in aerospace, automotive, telecommunications, medical devices, and advanced AI/ML edge computing.
Core Processing Architecture
- Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ – High-performance 64-bit application processing at 1.3GHz for demanding computational workloads
- Dual ARM® Cortex™-R5F with CoreSight™ – Real-time processing and control at 600MHz for deterministic, low-latency operations
- 1 Million Logic Cells – Extensive programmable logic fabric for custom hardware acceleration and parallel processing
- 256KB On-Chip RAM – High-speed embedded memory for efficient data buffering and processing
Advanced Connectivity & I/O
- High-Speed Serial: PCIe Gen4, 100G Ethernet, DDR4 memory interfaces
- Industrial Protocols: CANbus, EBI/EMI, I2C, SPI, UART/USART
- Storage & Multimedia: MMC/SD/SDIO, USB OTG
- DMA & Memory: Direct Memory Access controllers for efficient data movement
Reliability & Environmental Specifications
- Industrial Temperature Range: 0°C to 100°C (TJ) for reliable operation in harsh environments
- RoHS Compliant: Environmentally responsible and ready for global deployment
- Active Part Status: Full production availability with long lifecycle support
- Compact 2197-FCBGA Package: 45mm × 45mm footprint optimized for space-constrained designs
Target Applications
The XCVC1702-1MSEVSVA2197 excels in applications requiring:
- Aerospace & Defense: Radar signal processing, avionics, secure communications
- Automotive: ADAS, autonomous driving compute platforms, in-vehicle networking
- Telecommunications: 5G infrastructure, network function virtualization, edge computing
- Medical Devices: Real-time imaging, diagnostic equipment, patient monitoring systems
- Industrial Automation: Machine vision, robotics control, predictive maintenance
- AI/ML Edge Computing: Inference acceleration, neural network processing, sensor fusion
Documentation & Design Resources
Access comprehensive technical documentation, datasheets, application notes, and reference designs:
- AMD Versal™ AI Core Series Overview (DS950)
- Development tools, IP cores, and evaluation boards available
- Full traceability and lifecycle documentation for aerospace/automotive qualification
Why Choose XCVC1702-1MSEVSVA2197?
This Versal AI Core FPGA combines the flexibility of programmable logic with the performance of dedicated processing engines, enabling you to:
- Accelerate time-to-market with pre-verified IP and development tools
- Adapt to evolving standards and protocols through reconfigurable logic
- Achieve optimal power-performance balance for edge and embedded applications
- Ensure long-term availability and support for mission-critical deployments
Stock Availability: Active inventory with same-day shipping for qualified orders. Contact us for volume pricing, custom packaging, and lifecycle management programs.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2197-BFBGA, FCBGA |
| Supplier Device Package | 2197-FCBGA (45x45) |
| ROHS |

XCVC1702-1MSEVSVA2197.pdf