AMD XCVC1702-2LLENSVG1369

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 107,883.72
Normaler Preis Dhs. 113,561.79 Verkaufspreis Dhs. 107,883.72
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 107,883.72 Dhs. 107,883.72
15+ Dhs. 104,476.85 Dhs. 1,567,152.75
25+ Dhs. 102,205.61 Dhs. 2,555,140.25
50+ Dhs. 96,527.52 Dhs. 4,826,376.00
100+ Dhs. 85,171.34 Dhs. 8,517,134.00
N+ Dhs. 17,034.27 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

AMD Versal™ AI Core XCVC1702-2LLENSVG1369 FPGA System-on-Chip

The AMD Versal AI Core XCVC1702-2LLENSVG1369 represents the pinnacle of adaptive computing technology, combining high-performance FPGA fabric with embedded processing cores to deliver unmatched flexibility and performance for mission-critical applications across industrial, automotive, aerospace, communications, and edge computing segments.

Key Features & Benefits

  • 1 Million Logic Cells – Massive programmable logic capacity for complex designs
  • Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ – High-performance application processing at 1.08GHz
  • Dual ARM® Cortex™-R5F with CoreSight™ – Real-time processing at 450MHz for deterministic control
  • Advanced Connectivity – CANbus, Ethernet, PCIe, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial-Grade Reliability – 0°C to 100°C junction temperature operating range
  • Compact 1369-FCBGA Package – 35x35mm footprint for space-constrained designs

Ideal Applications

This Versal AI Core SoC is engineered for demanding applications requiring adaptive intelligence, real-time processing, and high-bandwidth connectivity including autonomous systems, 5G infrastructure, advanced driver assistance systems (ADAS), industrial automation, aerospace & defense, and edge AI inference.

Authentic AMD product with full traceability and documentation. Suitable for industrial-grade applications requiring long product lifecycles and reliable supply chain support.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 450MHz, 1.08GHz
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1369-BFBGA, FCBGA
Supplier Device Package 1369-FCBGA (35x35)