AMD XCVC1702-2MLENSVG1369
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 89,898.47 | Dhs. 89,898.47 |
| 15+ | Dhs. 87,059.56 | Dhs. 1,305,893.40 |
| 25+ | Dhs. 85,166.96 | Dhs. 2,129,174.00 |
| 50+ | Dhs. 80,435.47 | Dhs. 4,021,773.50 |
| 100+ | Dhs. 70,972.47 | Dhs. 7,097,247.00 |
| N+ | Dhs. 14,194.49 | Price Inquiry |
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AMD XCVC1702-2MLENSVG1369 Versal™ AI Core FPGA
The AMD XCVC1702-2MLENSVG1369 is a high-performance Versal™ AI Core FPGA featuring 1 million logic cells, designed for demanding applications in aerospace, automotive, industrial automation, and telecommunications. This advanced system-on-chip (SoC) combines adaptive computing with embedded processing power to deliver exceptional performance and flexibility.
Key Features & Benefits
- Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ - High-performance application processing at 1.4GHz
- Dual ARM® Cortex™-R5F with CoreSight™ - Real-time processing at 600MHz for deterministic control
- 1 Million Logic Cells - Extensive programmable logic resources for complex designs
- 256KB On-Chip RAM - Fast local memory for critical operations
- Rich Connectivity Options - CANbus, Ethernet, PCIe, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
- Industrial Temperature Range - Operates reliably from 0°C to 110°C (TJ)
- 1369-FCBGA Package (35x35mm) - Compact form factor for space-constrained designs
Applications
Ideal for advanced driver assistance systems (ADAS), industrial machine vision, 5G wireless infrastructure, aerospace avionics, medical imaging equipment, and high-performance embedded computing platforms requiring AI acceleration and adaptive processing.
Authorized Distribution & Support
We provide 100% authentic AMD components with full manufacturer documentation, traceability certificates, and long lifecycle availability. Our technical team offers design-in support, reference designs, and application guidance to accelerate your development cycle and mitigate obsolescence risk.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.4GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | 0°C ~ 110°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |
| ROHS |  |
XCVC1702-2MLENSVG1369.pdf