AMD XCVC1702-2MLINSVG1369
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 112,376.56 | Dhs. 112,376.56 |
| 15+ | Dhs. 108,827.82 | Dhs. 1,632,417.30 |
| 25+ | Dhs. 106,462.00 | Dhs. 2,661,550.00 |
| 50+ | Dhs. 100,547.44 | Dhs. 5,027,372.00 |
| 100+ | Dhs. 88,718.33 | Dhs. 8,871,833.00 |
| N+ | Dhs. 17,743.67 | Price Inquiry |
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AMD XCVC1702-2MLINSVG1369 Versal™ AI Core FPGA
The AMD XCVC1702-2MLINSVG1369 is a high-performance Versal™ AI Core FPGA featuring 1 million logic cells and advanced processing capabilities. This cutting-edge system-on-chip combines FPGA fabric with dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors, delivering exceptional computational power for AI, machine learning, and data center applications.
Key Features & Benefits
- Dual-core ARM® Cortex®-A72 MPCore™ with CoreSight™ for high-performance application processing
- Dual ARM® Cortex™-R5F with CoreSight™ for real-time control and safety-critical functions
- 1 Million Logic Cells providing extensive programmable logic resources
- 256KB RAM for efficient data processing and buffering
- Wide operating temperature range (-40°C to 110°C TJ) for industrial and harsh environment applications
- Comprehensive connectivity: CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART/USART, MMC/SD/SDIO
- High-speed performance: 600MHz and 1.4GHz processing speeds
- 1369-FCBGA package (35x35mm) for space-efficient board design
Ideal Applications
Perfect for aerospace systems, automotive ADAS, industrial automation, telecommunications infrastructure, medical imaging equipment, and AI/ML edge computing solutions requiring high reliability and long lifecycle support.
Why Choose Us: As an authorized distributor, we provide 100% authentic AMD components with full traceability, technical support, and long lifecycle commitment. All products are RoHS compliant and backed by our quality guarantee.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.4GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | -40°C ~ 110°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |
| ROHS |  |
XCVC1702-2MLINSVG1369.pdf