AMD XCVC1702-2MSENSVG1369
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 74,916.13 | Dhs. 74,916.13 |
| 15+ | Dhs. 72,550.35 | Dhs. 1,088,255.25 |
| 25+ | Dhs. 70,973.17 | Dhs. 1,774,329.25 |
| 50+ | Dhs. 67,030.22 | Dhs. 3,351,511.00 |
| 100+ | Dhs. 59,144.31 | Dhs. 5,914,431.00 |
| N+ | Dhs. 11,828.86 | Price Inquiry |
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AMD Versal™ AI Core FPGA - XCVC1702-2MSENSVG1369
High-performance Versal AI Core FPGA solution featuring 1 million logic cells with dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors. Ideal for aerospace, automotive, industrial automation, and telecommunications applications requiring advanced processing capabilities and extensive connectivity options.
Key Features:
- Advanced Processing: Dual ARM Cortex-A72 MPCore at 1.4GHz + Dual ARM Cortex-R5F at 600MHz
- High Logic Density: 1M Logic Cells for complex FPGA implementations
- Memory: 256KB integrated RAM
- Connectivity: PCIe, Ethernet, CANbus, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
- Peripherals: DDR, DMA, PCIe support
- Industrial Grade: Operating temperature 0°C to 110°C (TJ)
- Package: 1369-FCBGA (35x35mm)
- RoHS Compliant: Environmentally friendly manufacturing
Applications:
Perfect for high-performance embedded systems, AI acceleration, edge computing, industrial automation controllers, automotive ADAS systems, telecommunications infrastructure, and aerospace/defense applications requiring reliable, high-density FPGA solutions.
Quality Assurance:
Sourced from authorized AMD distributors with full manufacturer documentation, traceability, and long lifecycle support. Active part status ensures ongoing availability for your critical designs.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.4GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | 0°C ~ 110°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |
| ROHS |  |
XCVC1702-2MSENSVG1369.pdf