AMD XCVC1802-1LSIVSVD1760

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AMD Versal AI Core XCVC1802-1LSIVSVD1760 FPGA

The AMD Versal AI Core XCVC1802 represents the pinnacle of adaptive computing, combining high-performance FPGA fabric with heterogeneous processing cores. This industrial-grade SoC delivers exceptional flexibility for edge computing, embedded vision, automotive ADAS, aerospace systems, and 5G infrastructure applications.

Why Choose the XCVC1802?

Engineers and system architects select the XCVC1802 for mission-critical applications requiring real-time processing, hardware acceleration, and adaptive logic. With dual ARM Cortex-A72 cores running at 1GHz for application processing and dual Cortex-R5F cores at 400MHz for deterministic real-time control, this device handles complex heterogeneous workloads with ease.

Key Technical Highlights

  • 1.5M Logic Cells – Extensive programmable logic resources for complex FPGA designs and hardware acceleration
  • Dual ARM Cortex-A72 MPCore with CoreSight – High-performance 1GHz application processing with advanced debug capabilities
  • Dual ARM Cortex-R5F with CoreSight – Deterministic real-time processing at 400MHz for safety-critical functions
  • 256KB On-Chip RAM – Fast local memory for critical operations and low-latency data access
  • Advanced Connectivity – PCIe Gen4, DDR4/LPDDR4, Gigabit Ethernet, USB OTG, CANbus, SPI, I²C, UART/USART
  • Industrial Temperature Range – Operates reliably from -40°C to 100°C (TJ) for harsh environments
  • Compact 1760-FCBGA Package – Space-efficient 40mm × 40mm form factor for embedded designs

Target Applications

The XCVC1802 excels in demanding applications across multiple industries:

  • Edge Computing & AI Inference – Hardware-accelerated neural networks and machine learning at the edge
  • Embedded Vision Systems – Real-time image processing, object detection, and computer vision
  • Industrial Automation – Programmable logic controllers, motion control, and factory automation
  • Automotive ADAS – Advanced driver assistance systems with functional safety requirements
  • Aerospace & Defense – Avionics, radar processing, and secure communications
  • 5G Infrastructure – Baseband processing, beamforming, and network acceleration
  • Medical Imaging – Ultrasound, CT, and real-time diagnostic equipment

Design Resources & Support

Documentation: Complete datasheets, reference manuals, application notes, and design guides available from AMD Xilinx.

Development Tools: Compatible with AMD Vivado Design Suite and Vitis unified software platform for FPGA and embedded development.

Quality & Authenticity

Authenticity Guaranteed: Sourced exclusively from authorized AMD distributors with full supply chain traceability.

Compliance: RoHS compliant with complete documentation and certificates of conformance available upon request.

Long-Term Availability: Industrial-grade component with extended product lifecycle support for mission-critical applications.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)