AMD XCVC1802-1MLIVSVA2197
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 114,335.61 | Dhs. 114,335.61 |
| 15+ | Dhs. 110,724.99 | Dhs. 1,660,874.85 |
| 25+ | Dhs. 108,317.93 | Dhs. 2,707,948.25 |
| 50+ | Dhs. 102,300.26 | Dhs. 5,115,013.00 |
| 100+ | Dhs. 90,264.94 | Dhs. 9,026,494.00 |
| N+ | Dhs. 18,052.99 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.5M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2197-BFBGA, FCBGA |
| Supplier Device Package | 2197-FCBGA (45x45) |
AMD Versal™ AI Core XCVC1802-1MLIVSVA2197 FPGA System-on-Chip
The AMD Versal AI Core XCVC1802-1MLIVSVA2197 represents cutting-edge FPGA technology, delivering exceptional processing power and versatility for demanding industrial, automotive, aerospace, communications, and edge computing applications. This high-performance System-on-Chip combines 1.5 million logic cells with dual ARM® Cortex®-A72 MPCore™ processors and dual ARM® Cortex™-R5F cores, providing unparalleled computational capabilities for complex embedded systems.
Key Features & Benefits
- Massive Logic Capacity: 1.5M logic cells enable implementation of sophisticated algorithms and complex digital designs
- Heterogeneous Processing: Dual ARM Cortex-A72 MPCore (1.3GHz) + Dual ARM Cortex-R5F (600MHz) for optimal workload distribution
- Rich Connectivity: Integrated PCIe, DDR, Ethernet, CANbus, USB OTG, SPI, I2C, UART/USART, and MMC/SD/SDIO interfaces
- Industrial-Grade Reliability: Extended operating temperature range (-40°C to 100°C TJ) for harsh environments
- Advanced Packaging: 2197-FCBGA (45x45mm) for high-density integration and thermal performance
- Flexible Memory Architecture: 256KB on-chip RAM with DDR controller support for external memory expansion
Ideal Applications
This Versal AI Core FPGA is engineered for mission-critical applications requiring high computational throughput, real-time processing, and adaptive intelligence including autonomous systems, 5G/6G infrastructure, industrial automation, aerospace avionics, medical imaging, and AI/ML acceleration at the edge.
Why Choose This FPGA?
Backed by AMD's proven track record in high-performance computing, the XCVC1802-1MLIVSVA2197 delivers enterprise-grade reliability, comprehensive development tool support, and long product lifecycle commitment. Authentic components sourced directly from authorized channels ensure quality, traceability, and full manufacturer warranty coverage.
XCVC1802-1MLIVSVA2197.pdf