AMD XCVC1802-1MSEVIVA1596

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AMD Versal™ AI Core XCVC1802-1MSEVIVA1596 FPGA

The XCVC1802-1MSEVIVA1596 is a high-performance adaptive compute acceleration platform (ACAP) from AMD's Versal™ AI Core series, engineered for demanding applications in aerospace, automotive, communications, and industrial sectors.

Key Features

  • 1.5 Million Logic Cells - Extensive programmable logic resources for complex designs
  • Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ - High-performance 1.3GHz application processors
  • Dual ARM® Cortex™-R5F with CoreSight™ - Real-time 600MHz processors for deterministic control
  • 256KB On-Chip RAM - Fast embedded memory for critical operations
  • Advanced Connectivity - PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I²C, UART/USART
  • Industrial Temperature Range - Reliable operation from 0°C to 100°C (junction temperature)
  • 1596-FCBGA Package - 40mm × 40mm fine-pitch ball grid array for high-density integration

Applications

Ideal for AI inference acceleration, 5G wireless infrastructure, advanced driver assistance systems (ADAS), industrial automation, aerospace & defense systems, and high-performance embedded computing.

Documentation & Support

Full datasheets, reference designs, and technical documentation available from AMD. RoHS compliant. Authentic AMD product with full manufacturer traceability.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1596-BFBGA, FCBGA
Supplier Device Package 1596-FCBGA (40x40)