AMD XCVC1802-2LLEVSVA2197

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AMD Versal AI Core XCVC1802-2LLEVSVA2197 FPGA

High-performance adaptive compute acceleration platform combining programmable logic with dual ARM Cortex-A72 MPCore and dual Cortex-R5F processors. Engineered for AI inference, edge computing, aerospace, automotive, and industrial applications requiring deterministic real-time processing.

Key Features

  • 1.5M Logic Cells – Extensive programmable fabric for complex HDL designs
  • Dual ARM Cortex-A72 MPCore with CoreSight – High-performance application processing at 1.08 GHz
  • Dual ARM Cortex-R5F with CoreSight – Real-time control at 450 MHz
  • 256KB On-Chip RAM – Low-latency memory for critical operations
  • Industrial Temperature Range – Reliable operation from 0°C to 100°C (TJ)
  • Rich Connectivity – PCIe, Ethernet, USB OTG, CANbus, DDR, SPI, I2C, UART, MMC/SD/SDIO
  • 2197-FCBGA Package – 45mm × 45mm fine-pitch ball grid array for high I/O density

Applications

Ideal for advanced driver assistance systems (ADAS), 5G wireless infrastructure, machine vision, industrial automation, avionics, medical imaging, and high-performance embedded computing where FPGA flexibility meets processor integration.

Compliance & Documentation

RoHS compliant. Full datasheets and reference designs available from AMD. Authentic components with full traceability.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 450MHz, 1.08GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)