AMD XCVC1802-2MSEVIVA1596

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Normaler Preis Dhs. 88,222.84
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Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.4GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1596-BFBGA, FCBGA
Supplier Device Package 1596-FCBGA (40x40)

AMD XCVC1802-2MSEVIVA1596 Versal™ AI Core FPGA

High-performance System-on-Chip (SoC) FPGA combining adaptive logic with dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors. Engineered for AI inference, embedded vision, industrial automation, aerospace, and high-bandwidth communications applications requiring 1.5 million logic cells and extensive connectivity.

Key Features

  • 1.5M Logic Cells – Versal AI Core architecture for compute-intensive workloads
  • Dual-core ARM Cortex-A72 (1.4 GHz) + Dual-core ARM Cortex-R5F (600 MHz) with CoreSight debug
  • 256KB on-chip RAM with DDR, DMA, and PCIe peripheral support
  • Rich connectivity: CANbus, Ethernet, USB OTG, I²C, SPI, UART, MMC/SD/SDIO
  • Industrial temperature range: 0°C to 100°C (TJ)
  • 1596-FCBGA package (40×40 mm) for high I/O density

Applications

Ideal for edge AI inference, 5G wireless infrastructure, automotive ADAS, machine vision, software-defined radio, and mission-critical embedded systems requiring deterministic real-time processing alongside programmable logic.

Documentation: Full datasheets, reference designs, and Vivado™ tool support available from AMD.

RoHS compliant. Suitable for industrial, automotive, and aerospace applications.