AMD XCVC1802-2MSEVSVA2197

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Normaler Preis Dhs. 95,284.68
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AMD Versal™ AI Core XCVC1802-2MSEVSVA2197 FPGA

High-performance System-on-Chip (SoC) FPGA designed for demanding industrial, automotive, aerospace, communications, and edge computing applications. This advanced Versal AI Core device combines 1.5 million logic cells with dual ARM® Cortex®-A72 and Cortex®-R5F processors, delivering exceptional processing power and flexibility for complex embedded systems.

Key Features

  • 1.5M Logic Cells – Extensive FPGA fabric for complex digital logic implementation
  • Dual-Core Processing – ARM Cortex-A72 MPCore (1.4GHz) + ARM Cortex-R5F (600MHz) with CoreSight debug
  • 256KB On-Chip RAM – Fast embedded memory for critical data processing
  • Rich Connectivity – PCIe, Ethernet, USB OTG, CANbus, I2C, SPI, UART, MMC/SD/SDIO interfaces
  • Industrial Temperature Range – Reliable operation from 0°C to 100°C (junction temperature)
  • Compact 2197-FCBGA Package – 45mm × 45mm flip-chip ball grid array for high-density designs

Ideal Applications

Perfect for high-performance embedded vision, AI inference at the edge, software-defined networking, 5G wireless infrastructure, advanced driver assistance systems (ADAS), aerospace avionics, and industrial automation requiring deterministic real-time control with FPGA acceleration.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.4GHz
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)