AMD XCVC1902-1LLIVSVA2197

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Normaler Preis Dhs. 152,450.44
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Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)

AMD Versal AI Core FPGA - XCVC1902-1LLIVSVA2197

High-performance adaptive compute acceleration platform combining programmable logic with dual ARM Cortex-A72 MPCore and dual ARM Cortex-R5F processors. Engineered for demanding industrial, automotive, aerospace, and communications applications requiring advanced processing capabilities and extensive connectivity options.

Key Features

  • 1.9 million logic cells for complex FPGA designs
  • Dual ARM Cortex-A72 MPCore with CoreSight running at 1GHz
  • Dual ARM Cortex-R5F with CoreSight at 400MHz
  • 256KB integrated RAM
  • Industrial temperature range: -40°C to 100°C (TJ)
  • Comprehensive connectivity: PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I2C, UART
  • 2197-FCBGA package (45x45mm)

Applications: Industrial automation, automotive ADAS, aerospace systems, 5G communications infrastructure, edge AI processing, high-performance embedded computing.

Documentation: Full datasheets and technical documentation available from AMD.