AMD XCVC1902-1LSEVSVD1760
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 97,873.87 | Dhs. 97,873.87 |
| 15+ | Dhs. 94,783.12 | Dhs. 1,421,746.80 |
| 25+ | Dhs. 92,722.62 | Dhs. 2,318,065.50 |
| 50+ | Dhs. 87,571.36 | Dhs. 4,378,568.00 |
| 100+ | Dhs. 77,268.85 | Dhs. 7,726,885.00 |
| N+ | Dhs. 15,453.77 | Price Inquiry |
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AMD Versal AI Core XCVC1902-1LSEVSVD1760 FPGA
High-performance adaptive compute acceleration platform combining scalar processing engines, adaptable hardware engines, and intelligent engines with leading-edge memory and interfacing technologies. The XCVC1902 delivers 1.9 million logic cells with dual ARM Cortex-A72 MPCore and dual ARM Cortex-R5F processors for demanding aerospace, automotive, communications, and industrial applications.
Key Features
- 1.9M Logic Cells - Massive programmable logic capacity for complex designs
- Dual ARM Cortex-A72 MPCore with CoreSight (1GHz) - High-performance application processing
- Dual ARM Cortex-R5F with CoreSight (400MHz) - Real-time processing capability
- 256KB On-Chip RAM - Fast local memory for critical operations
- Advanced Connectivity - PCIe, Ethernet, USB OTG, CANbus, DDR, SPI, I2C, UART
- Industrial Temperature Range - 0°C to 100°C junction temperature
- 1760-FCBGA Package - 40mm x 40mm fine-pitch ball grid array
Applications
Ideal for advanced driver assistance systems (ADAS), 5G wireless infrastructure, aerospace & defense systems, test & measurement equipment, industrial automation, edge AI inference, and high-performance embedded computing.
Documentation & Support
Full datasheets, reference designs, and technical documentation available from AMD. RoHS compliant. Authentic AMD product with full traceability.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.9M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
XCVC1902-1LSEVSVD1760.pdf