AMD XCVC1902-1MLIVSVD1760
Normaler Preis
Dhs. 122,346.79
Normaler Preis
Dhs. 128,786.09
Verkaufspreis
Dhs. 122,346.79
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 122,346.79 | Dhs. 122,346.79 |
| 15+ | Dhs. 118,483.20 | Dhs. 1,777,248.00 |
| 25+ | Dhs. 115,907.48 | Dhs. 2,897,687.00 |
| 50+ | Dhs. 109,468.18 | Dhs. 5,473,409.00 |
| 100+ | Dhs. 96,589.57 | Dhs. 9,658,957.00 |
| N+ | Dhs. 19,317.91 | Price Inquiry |
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AMD Versal AI Core FPGA - XCVC1902-1MLIVSVD1760
The XCVC1902-1MLIVSVD1760 is a high-performance Versal AI Core FPGA from AMD, featuring 1.9 million logic cells and advanced heterogeneous processing capabilities. Designed for demanding applications in aerospace, automotive, communications, and industrial sectors, this device combines adaptive computing with embedded processing power.
Key Features
- 1.9M Logic Cells - Massive programmable logic capacity for complex designs
- Dual ARM Cortex-A72 MPCore with CoreSight at 1.3GHz - High-performance application processing
- Dual ARM Cortex-R5F with CoreSight at 600MHz - Real-time processing and control
- 256KB On-Chip RAM - Fast local memory for critical operations
- Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ)
- Rich Connectivity - PCIe, Ethernet, USB OTG, CANbus, SPI, I2C, UART/USART, MMC/SD/SDIO
- 1760-FCBGA Package (40x40mm) - Compact form factor with extensive I/O
Applications
Ideal for advanced driver assistance systems (ADAS), 5G wireless infrastructure, aerospace avionics, industrial automation, edge AI acceleration, and high-performance embedded computing platforms requiring adaptive hardware acceleration.
Documentation: Full datasheets and technical reference manuals available from AMD.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.9M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
XCVC1902-1MLIVSVD1760.pdf
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