AMD
XCVC1902-1MSEVSVD1760
XCVC1902-1MSEVSVD1760
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 81,564.99 AED | Dhs. 81,564.99 AED |
| 15+ | Dhs. 78,989.23 AED | Dhs. 1,184,838.45 AED |
| 25+ | Dhs. 77,272.07 AED | Dhs. 1,931,801.75 AED |
| 50+ | Dhs. 72,979.18 AED | Dhs. 3,648,959.00 AED |
| 100+ | Dhs. 64,393.40 AED | Dhs. 6,439,340.00 AED |
| N+ | Dhs. 12,878.68 AED | Price Inquiry |
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AMD Versal AI Core XCVC1902-1MSEVSVD1760 FPGA
The XCVC1902-1MSEVSVD1760 is a high-performance Versal™ AI Core FPGA from AMD, featuring 1.9 million logic cells and advanced heterogeneous processing capabilities. This industrial-grade programmable SoC combines dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors with extensive FPGA fabric, making it ideal for demanding applications in aerospace, automotive, communications, and industrial automation.
Key Features
- 1.9M Logic Cells – Extensive programmable logic resources for complex designs
- Dual-Core ARM Cortex-A72 (1.3GHz) – High-performance application processing with CoreSight™ debug
- Dual-Core ARM Cortex-R5F (600MHz) – Real-time processing for deterministic control tasks
- 256KB On-Chip RAM – Fast local memory for critical operations
- Rich Connectivity – PCIe, Ethernet, USB OTG, CANbus, SPI, I²C, UART, MMC/SD/SDIO interfaces
- Industrial Temperature Range – Qualified for 0°C to 100°C junction temperature operation
- 1760-FCBGA Package – 40mm × 40mm fine-pitch ball grid array for high I/O density
Applications
This Versal AI Core device is engineered for high-reliability systems requiring adaptive compute acceleration, including 5G wireless infrastructure, advanced driver assistance systems (ADAS), industrial vision and robotics, aerospace avionics, test and measurement equipment, and edge AI inference workloads.
Technical Specifications
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.9M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
Documentation & Support
Full datasheets, reference designs, and development tools are available from AMD. This device is backed by comprehensive technical documentation and long-term product availability commitments suitable for mission-critical deployments.
Datasheets:
XCVC1902-1MSEVSVD1760
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