AMD XCVC1902-2LLEVIVA1596
Normaler Preis
Dhs. 141,165.25
Normaler Preis
Dhs. 148,595.01
Verkaufspreis
Dhs. 141,165.25
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 141,165.25 | Dhs. 141,165.25 |
| 15+ | Dhs. 136,707.41 | Dhs. 2,050,611.15 |
| 25+ | Dhs. 133,735.51 | Dhs. 3,343,387.75 |
| 50+ | Dhs. 126,305.76 | Dhs. 6,315,288.00 |
| 100+ | Dhs. 111,446.26 | Dhs. 11,144,626.00 |
| N+ | Dhs. 22,289.25 | Price Inquiry |
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AMD Versal™ AI Core XCVC1902-2LLEVIVA1596 FPGA
The XCVC1902-2LLEVIVA1596 is a high-performance System-on-Chip (SoC) FPGA from AMD's Versal™ AI Core series, engineered for demanding industrial, automotive, aerospace, communications, and edge computing applications. This advanced device combines adaptive FPGA fabric with embedded processing subsystems to deliver exceptional performance and flexibility.
Key Features
- 1.9 Million Logic Cells – Massive programmable logic capacity for complex designs
- Dual ARM® Cortex®-A72 MPCore™ – High-performance application processors with CoreSight™ debug
- Dual ARM® Cortex™-R5F – Real-time processors with CoreSight™ for deterministic control
- 256KB On-Chip RAM – Fast embedded memory for data buffering and processing
- Multi-Speed Operation – 450MHz and 1.08GHz clock domains for optimized power/performance
- Industrial Temperature Range – Qualified for 0°C to 100°C (TJ) operation
- Rich Connectivity – CANbus, Ethernet, PCIe, USB OTG, I2C, SPI, UART, MMC/SD/SDIO interfaces
- 1596-FCBGA Package – Compact 40x40mm flip-chip ball grid array for high-density designs
Applications
Ideal for advanced driver assistance systems (ADAS), 5G wireless infrastructure, industrial automation, aerospace/defense systems, high-performance computing, AI/ML acceleration at the edge, and software-defined radio platforms.
All specifications are subject to AMD's published datasheet. For complete technical documentation, please refer to the official AMD Versal AI Core documentation.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 450MHz, 1.08GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.9M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1596-BFBGA, FCBGA |
| Supplier Device Package | 1596-FCBGA (40x40) |
XCVC1902-2LLEVIVA1596.pdf
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