AMD XCVC1902-2MLEVSVD1760

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AMD Versal AI Core XCVC1902-2MLEVSVD1760 FPGA

The XCVC1902-2MLEVSVD1760 is a high-performance System-on-Chip (SoC) FPGA from AMD's Versal AI Core series, engineered for demanding applications in industrial automation, aerospace, automotive, and communications infrastructure. With 1.9 million logic cells and advanced heterogeneous processing architecture, this device delivers exceptional computational power and flexibility.

Key Features

  • Dual ARM Cortex-A72 MPCore processors with CoreSight (1.4 GHz) for high-performance application processing
  • Dual ARM Cortex-R5F real-time processors with CoreSight (600 MHz) for deterministic control tasks
  • 1.9M programmable logic cells for custom hardware acceleration and parallel processing
  • 256KB on-chip RAM for low-latency data access
  • Industrial temperature range: 0°C to 100°C (junction temperature)
  • Rich connectivity: PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I²C, UART, MMC/SD/SDIO
  • 1760-pin FCBGA package (40mm × 40mm) for high I/O density

Applications

Ideal for edge AI inference, 5G wireless infrastructure, advanced driver assistance systems (ADAS), industrial vision systems, software-defined radio, and high-speed data acquisition platforms requiring adaptive compute acceleration.

Documentation: Full datasheets and technical reference manuals available from AMD. RoHS compliant. Authentic AMD product with full traceability.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.4GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)