AMD XCVE1752-1LLINSVG1369

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Normaler Preis Dhs. 97,039.80
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Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1369-BFBGA, FCBGA
Supplier Device Package 1369-FCBGA (35x35)

AMD Versal™ AI Core XCVE1752-1LLINSVG1369 FPGA

The AMD Versal AI Core XCVE1752-1LLINSVG1369 is a high-performance System-on-Chip (SoC) FPGA designed for demanding industrial, automotive, aerospace, and edge computing applications. Featuring 1 million logic cells and a powerful heterogeneous processing architecture, this device delivers exceptional computational flexibility and performance.

Key Features

  • Dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ running at 1GHz for high-performance application processing
  • Dual ARM® Cortex™-R5F real-time processors with CoreSight™ at 400MHz for deterministic control tasks
  • 1 million logic cells of FPGA fabric for custom hardware acceleration and parallel processing
  • Industrial-grade temperature range: -40°C to +100°C (TJ) for harsh environment deployment
  • Comprehensive connectivity: PCIe, Ethernet, USB OTG, CANbus, I2C, SPI, UART/USART, MMC/SD/SDIO
  • High-speed peripherals: DDR memory controller, DMA, PCIe for maximum throughput
  • Compact 1369-FCBGA package (35mm × 35mm) for space-constrained designs

Applications

Ideal for AI/ML inference at the edge, advanced driver assistance systems (ADAS), industrial automation, 5G wireless infrastructure, aerospace/defense systems, medical imaging, and high-performance embedded computing platforms requiring adaptive hardware acceleration.

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