AMD XCVE1752-1LSENSVG1369

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Normaler Preis Dhs. 64,694.65
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AMD Versal™ AI Core XCVE1752-1LSENSVG1369 FPGA

High-performance adaptive compute acceleration platform combining scalar processing engines, adaptable hardware engines, and intelligent engines with leading-edge memory and interfacing technologies. The XCVE1752 delivers 1M logic cells in a compact 1369-FCBGA package, ideal for AI inference, embedded vision, and advanced driver assistance systems (ADAS).

Key Features

  • Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ running at 1GHz for application processing
  • Dual ARM® Cortex™-R5F with CoreSight™ at 400MHz for real-time control
  • 1M Logic Cells for extensive programmable logic resources
  • Industrial temperature range: 0°C to 100°C (TJ)
  • Rich connectivity: PCIe, Ethernet, USB OTG, CANbus, DDR, SPI, I2C, UART/USART
  • Compact 35x35mm 1369-FCBGA package for space-constrained designs

Applications

Designed for demanding edge computing, industrial automation, automotive systems, aerospace/defense, 5G wireless infrastructure, and AI/ML acceleration workloads requiring deterministic real-time performance and adaptive hardware acceleration.

Documentation: Full datasheets and technical reference manuals available from AMD.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1369-BFBGA, FCBGA
Supplier Device Package 1369-FCBGA (35x35)