AMD XCVE1752-1LSINSVG1369
Normaler Preis
Dhs. 80,870.53
Normaler Preis
Dhs. 85,126.85
Verkaufspreis
Dhs. 80,870.53
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 80,870.53 | Dhs. 80,870.53 |
| 15+ | Dhs. 78,316.70 | Dhs. 1,174,750.50 |
| 25+ | Dhs. 76,614.17 | Dhs. 1,915,354.25 |
| 50+ | Dhs. 72,357.82 | Dhs. 3,617,891.00 |
| 100+ | Dhs. 63,845.14 | Dhs. 6,384,514.00 |
| N+ | Dhs. 12,769.03 | Price Inquiry |
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AMD Versal™ AI Core XCVE1752-1LSINSVG1369 - High-Performance FPGA SoC
The AMD Versal AI Core XCVE1752-1LSINSVG1369 represents cutting-edge FPGA technology, combining adaptive computing with embedded processing power. This advanced System-on-Chip delivers exceptional performance for AI acceleration, edge computing, communications infrastructure, and mission-critical aerospace applications.
Key Features & Benefits
- Massive Logic Capacity: 1 million logic cells provide extensive programmable resources for complex designs
- Dual Processing Cores: ARM Cortex-A72 MPCore (1GHz) and Cortex-R5F (400MHz) deliver robust embedded processing
- Advanced Connectivity: Comprehensive I/O including PCIe, Ethernet, USB OTG, CANbus, and high-speed serial interfaces
- Industrial-Grade Reliability: Extended temperature range (-40°C to 100°C TJ) for harsh environments
- Flexible Integration: DDR memory interface, DMA, and multiple communication protocols
Ideal Applications
Perfect for demanding applications in industrial automation, 5G/6G wireless infrastructure, automotive ADAS systems, aerospace & defense, medical imaging, and AI/ML edge inference workloads.
Backed by AMD's industry-leading support and comprehensive development tools. Contact us for volume pricing, technical documentation, and application engineering assistance.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |
XCVE1752-1LSINSVG1369.pdf
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