AMD XCVE1752-1MSENSVG1369
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 53,912.80 | Dhs. 53,912.80 |
| 15+ | Dhs. 52,210.29 | Dhs. 783,154.35 |
| 25+ | Dhs. 51,075.29 | Dhs. 1,276,882.25 |
| 50+ | Dhs. 48,237.77 | Dhs. 2,411,888.50 |
| 100+ | Dhs. 42,562.74 | Dhs. 4,256,274.00 |
| N+ | Dhs. 8,512.55 | Price Inquiry |
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AMD Versal™ AI Core XCVE1752-1MSENSVG1369 FPGA
The AMD Versal AI Core XCVE1752-1MSENSVG1369 is a high-performance adaptive SoC combining 1M logic cells with dual ARM® Cortex®-A72 MPCore™ processors and dual ARM® Cortex™-R5F cores. This advanced FPGA solution delivers exceptional processing power for AI edge applications, aerospace systems, automotive electronics, and industrial automation.
Key Features & Benefits
- 1M Logic Cells - Massive programmable logic capacity for complex designs
- Dual ARM Cortex-A72 MPCore (1.3GHz) - High-performance application processing with CoreSight™ debug
- Dual ARM Cortex-R5F (600MHz) - Real-time processing for safety-critical applications
- 256KB Integrated RAM - On-chip memory for low-latency operations
- Advanced Connectivity - PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I2C, UART/USART
- Industrial Temperature Range - 0°C to 100°C (TJ) for demanding environments
- 1369-FCBGA Package - Compact 35x35mm footprint for space-constrained designs
Ideal Applications
Perfect for AI edge computing, 5G infrastructure, automotive ADAS systems, industrial IoT gateways, aerospace avionics, medical imaging equipment, and high-performance embedded systems requiring adaptive compute acceleration.
Why Choose This FPGA?
Backed by AMD's proven Versal architecture, this device combines the flexibility of programmable logic with the performance of hardened processors. The heterogeneous compute platform enables you to optimize power, performance, and area for your specific application while maintaining long-term product availability and comprehensive technical support.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ AI Edge FPGA, 1M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |
| ROHS |  |
XCVE1752-1MSENSVG1369.pdf