AMD XCVE1752-2LLENSVG1369

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Normaler Preis Dhs. 97,046.41
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The AMD XCVE1752-2LLENSVG1369 is a high-performance Versal™ AI Core FPGA designed for demanding industrial, automotive, and aerospace applications. This advanced system-on-chip (SoC) combines 1 million logic cells with dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors, delivering exceptional processing power for AI edge computing, real-time control, and data-intensive workloads.

Key Features:

  • 1M Logic Cells for complex FPGA designs
  • Dual ARM Cortex-A72 (1.08GHz) + Dual ARM Cortex-R5F (450MHz) processors
  • Comprehensive connectivity: PCIe, Ethernet, USB OTG, CANbus, DDR, SPI, I2C, UART
  • 1369-FCBGA package (35x35mm) for high-density integration
  • Industrial temperature range: 0°C to 100°C (TJ)
  • Ideal for AI acceleration, vision processing, and heterogeneous computing

This FPGA is perfect for engineers developing next-generation embedded systems requiring adaptive hardware acceleration, real-time processing, and AI inference at the edge. Backed by AMD's comprehensive development tools and long-term availability commitment.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 450MHz, 1.08GHz
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1369-BFBGA, FCBGA
Supplier Device Package 1369-FCBGA (35x35)