AMD XCVE1752-2LSEVSVA2197

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Normaler Preis Dhs. 91,412.43
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Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 450MHz, 1.08GHz
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)

AMD Versal AI Core XCVE1752-2LSEVSVA2197 FPGA

The AMD XCVE1752-2LSEVSVA2197 is a high-performance Versal™ AI Core FPGA featuring 1 million logic cells, designed for advanced embedded processing and AI acceleration applications in industrial, automotive, aerospace, and communications systems.

Key Features

  • Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ for high-performance application processing
  • Dual ARM® Cortex™-R5F with CoreSight™ for real-time control
  • 1M Logic Cells for extensive programmable logic resources
  • High-speed connectivity: PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I2C, UART/USART
  • Processing speeds: 450MHz and 1.08GHz
  • Industrial temperature range: 0°C to 100°C (TJ)
  • Compact 2197-FCBGA package (45x45mm)

Applications

Ideal for AI inference at the edge, advanced driver assistance systems (ADAS), industrial automation, 5G wireless infrastructure, aerospace & defense systems, and high-performance embedded computing platforms requiring adaptive hardware acceleration.

Documentation: Full datasheets, reference designs, and development tools available from AMD.

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