AMD XCVM1302-1LSENSVF1369

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AMD Versal Prime XCVM1302-1LSENSVF1369 FPGA SoC

High-performance Versal Prime adaptive compute acceleration platform (ACAP) featuring dual ARM Cortex-A72 MPCore and dual ARM Cortex-R5F processors with CoreSight debug. Engineered for industrial, automotive, aerospace, and communications applications requiring robust processing power and extensive connectivity.

Key Features

  • Dual-core ARM Cortex-A72 MPCore running at 1.3GHz with CoreSight debug
  • Dual ARM Cortex-R5F real-time processors at 600MHz
  • 70,000 logic cells for flexible FPGA fabric implementation
  • 256KB integrated RAM for fast data access
  • Advanced connectivity: PCIe, DDR, Ethernet, CANbus, USB OTG, I2C, SPI, UART/USART
  • Industrial temperature range: 0°C to 100°C (TJ)
  • Compact 1369-BGA package (35mm × 35mm) for space-constrained designs

Applications

Ideal for edge computing, embedded vision, motor control, industrial automation, automotive ADAS, aerospace avionics, and high-speed communications infrastructure.

Documentation: Full datasheets, reference designs, and technical documentation available from AMD.

Authenticity Guaranteed: Sourced from authorized distributors with full traceability and RoHS compliance.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ Prime
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Primary Attributes Versal™ Prime FPGA, 70k Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1369-BFBGA
Supplier Device Package 1369-BGA (35x35)