AMD XCVM1302-1LSINBVB1024
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 17,468.76 | Dhs. 17,468.76 |
| 15+ | Dhs. 16,917.13 | Dhs. 253,756.95 |
| 25+ | Dhs. 16,549.36 | Dhs. 413,734.00 |
| 50+ | Dhs. 15,629.95 | Dhs. 781,497.50 |
| 100+ | Dhs. 13,791.14 | Dhs. 1,379,114.00 |
| N+ | Dhs. 2,758.23 | Price Inquiry |
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AMD XCVM1302-1LSINBVB1024 Versal™ Prime FPGA
The XCVM1302-1LSINBVB1024 is a high-performance Versal Prime adaptive compute acceleration platform (ACAP) from AMD, featuring 70,000 logic cells and advanced processing capabilities. This industrial-grade FPGA combines dual ARM® Cortex®-A72 MPCore™ with CoreSight™ and dual ARM® Cortex™-R5F processors, delivering exceptional performance for aerospace, automotive, industrial automation, and telecommunications applications.
Key Features
- Advanced Processing: Dual ARM Cortex-A72 MPCore (1GHz) + Dual ARM Cortex-R5F (400MHz) with CoreSight debug
- 70k Logic Cells: Versal Prime FPGA architecture for complex digital designs
- Rich Connectivity: CANbus, Ethernet, PCIe, USB OTG, I2C, SPI, UART, MMC/SD/SDIO interfaces
- Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environments
- Compact Package: 1024-ball BGA (31x31mm) for space-constrained designs
- RoHS Compliant: Meets environmental standards for global deployment
Applications
Ideal for aerospace flight control systems, automotive ADAS and infotainment, industrial automation controllers, 5G/telecom infrastructure, medical imaging equipment, and high-performance embedded computing platforms requiring long-term availability and traceable sourcing.
Authorized Distribution
Sourced exclusively from authorized AMD distributors with full manufacturer documentation, traceability certificates, and warranty support. All units are factory-sealed in original tray packaging with lot traceability for mission-critical applications.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1024-BFBGA |
| Supplier Device Package | 1024-BGA (31x31) |
| ROHS |  |
XCVM1302-1LSINBVB1024.pdf