AMD XCVM1302-1MSENSVF1369
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 12,113.08 | Dhs. 12,113.08 |
| 15+ | Dhs. 11,730.57 | Dhs. 175,958.55 |
| 25+ | Dhs. 11,475.56 | Dhs. 286,889.00 |
| 50+ | Dhs. 10,838.03 | Dhs. 541,901.50 |
| 100+ | Dhs. 9,562.97 | Dhs. 956,297.00 |
| N+ | Dhs. 1,912.59 | Price Inquiry |
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AMD Versal™ Prime XCVM1302-1MSENSVF1369 FPGA
The XCVM1302-1MSENSVF1369 is a high-performance Versal Prime FPGA from AMD, featuring a sophisticated heterogeneous architecture combining adaptive computing with embedded processing. This engineering-grade component delivers exceptional performance for mission-critical aerospace, automotive, industrial automation, and telecommunications applications.
Key Features & Benefits
- Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ - High-performance application processing at 1.3GHz
- Dual ARM® Cortex™-R5F with CoreSight™ - Real-time processing at 600MHz for deterministic control
- 70,000 Logic Cells - Extensive programmable logic resources for complex designs
- Advanced Connectivity - CANbus, Ethernet, PCIe, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
- Industrial Temperature Range - Operates reliably from 0°C to 100°C (TJ)
- RoHS Compliant - Meets environmental and regulatory standards
- 1369-BGA Package (35x35mm) - Compact form factor with high I/O density
Applications
This Versal Prime FPGA is optimized for:
- Aerospace & defense embedded systems
- Automotive ADAS and autonomous driving platforms
- Industrial automation and machine vision
- 5G wireless infrastructure and telecommunications
- High-performance edge computing
- Medical imaging and diagnostic equipment
Authentic Sourcing & Documentation
All units are sourced exclusively from authorized AMD distributors with full manufacturer documentation and traceability. Each device ships with complete datasheets and technical reference materials to support your design and integration requirements.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA |
| Supplier Device Package | 1369-BGA (35x35) |
| ROHS |

XCVM1302-1MSENSVF1369.pdf