AMD XCVM1302-1MSEVSVD1760
Normaler Preis
Dhs. 13,042.82
Normaler Preis
Dhs. 13,729.28
Verkaufspreis
Dhs. 13,042.82
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 13,042.82 | Dhs. 13,042.82 |
| 15+ | Dhs. 12,630.94 | Dhs. 189,464.10 |
| 25+ | Dhs. 12,356.35 | Dhs. 308,908.75 |
| 50+ | Dhs. 11,669.89 | Dhs. 583,494.50 |
| 100+ | Dhs. 10,296.96 | Dhs. 1,029,696.00 |
| N+ | Dhs. 2,059.39 | Price Inquiry |
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AMD Versal™ Prime XCVM1302-1MSEVSVD1760 FPGA
The AMD Versal Prime XCVM1302 represents the next generation of adaptive computing acceleration platforms (ACAP), combining high-performance FPGA fabric with dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors. Engineered for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications infrastructure.
Key Features & Benefits
- Advanced Processing Architecture: Dual ARM Cortex-A72 cores running at 1.3GHz plus dual Cortex-R5F cores at 600MHz deliver exceptional computational performance
- 70,000 Logic Cells: Extensive FPGA resources for complex digital signal processing, custom logic implementation, and hardware acceleration
- Rich Connectivity: Integrated CANbus, Ethernet, PCIe, USB OTG, I2C, SPI, UART/USART, and MMC/SD/SDIO interfaces
- Industrial Temperature Range: Qualified for 0°C to 100°C (TJ) operation, ensuring reliable performance in demanding environments
- High-Density Package: 1760-ball FCBGA (40x40mm) optimized for space-constrained designs
- RoHS Compliant: Meets environmental and regulatory standards for global deployment
Ideal Applications
This Versal Prime ACAP is purpose-built for applications requiring deterministic real-time processing, hardware acceleration, and adaptive intelligence including aerospace avionics, automotive ADAS/autonomous systems, industrial robotics, 5G wireless infrastructure, medical imaging equipment, and high-reliability embedded systems.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
| ROHS |  |
XCVM1302-1MSEVSVD1760.pdf
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