AMD XCVM1302-1MSINBVB1024

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AMD Versal™ Prime XCVM1302-1MSINBVB1024 FPGA

The XCVM1302-1MSINBVB1024 is a high-performance adaptive compute acceleration platform (ACAP) from AMD's Versal™ Prime series, combining FPGA fabric with dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors. This versatile SoC delivers exceptional processing power with 70k logic cells and comprehensive connectivity options including PCIe, Ethernet, USB OTG, and CANbus.

Key Features

  • Dual-core ARM Cortex-A72 MPCore at 1.3GHz with CoreSight™ debug technology
  • Dual ARM Cortex-R5F at 600MHz for real-time processing
  • 70,000 logic cells for flexible FPGA implementation
  • Industrial temperature range: -40°C to 100°C (TJ)
  • 1024-BGA package (31x31mm) for high-density integration
  • RoHS compliant for environmental compliance

Connectivity & Peripherals

Comprehensive I/O support including DDR memory interface, DMA, PCIe, CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG ensures seamless integration into aerospace, automotive, industrial, medical, and telecommunications applications.

Applications

Ideal for high-reliability embedded systems requiring long lifecycle support, including aerospace avionics, automotive ADAS, industrial automation, medical imaging, and telecom infrastructure.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ Prime
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Primary Attributes Versal™ Prime FPGA, 70k Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1024-BFBGA
Supplier Device Package 1024-BGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY