AMD XCVM1302-1MSINSVF1369
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 15,138.02 | Dhs. 15,138.02 |
| 15+ | Dhs. 14,659.99 | Dhs. 219,899.85 |
| 25+ | Dhs. 14,341.29 | Dhs. 358,532.25 |
| 50+ | Dhs. 13,544.55 | Dhs. 677,227.50 |
| 100+ | Dhs. 11,951.08 | Dhs. 1,195,108.00 |
| N+ | Dhs. 2,390.22 | Price Inquiry |
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The AMD XCVM1302-1MSINSVF1369 is a high-performance Versal™ Prime FPGA featuring 70,000 logic cells and advanced processing capabilities. This adaptive compute acceleration platform (ACAP) integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5F processors, delivering exceptional computational power for demanding applications in aerospace, automotive, industrial automation, and telecommunications.
Engineered for reliability and long-term availability, this device supports comprehensive connectivity options including CANbus, Ethernet, PCIe, USB OTG, and multiple serial interfaces. Operating across an extended temperature range of -40°C to 100°C, the XCVM1302-1MSINSVF1369 is RoHS compliant and packaged in a compact 1369-BGA (35x35mm) format, making it ideal for space-constrained, mission-critical designs.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA |
| Supplier Device Package | 1369-BGA (35x35) |
| ROHS |  |
XCVM1302-1MSINSVF1369.pdf