AMD XCVM1302-2MSINSVF1369

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 18,923.67
Normaler Preis Dhs. 19,919.63 Verkaufspreis Dhs. 18,923.67
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 18,923.67 Dhs. 18,923.67
15+ Dhs. 18,326.06 Dhs. 274,890.90
25+ Dhs. 17,927.67 Dhs. 448,191.75
50+ Dhs. 16,931.69 Dhs. 846,584.50
100+ Dhs. 14,939.72 Dhs. 1,493,972.00
N+ Dhs. 2,987.94 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ Prime
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.4GHz
Primary Attributes Versal™ Prime FPGA, 70k Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1369-BFBGA
Supplier Device Package 1369-BGA (35x35)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

AMD Versal™ Prime XCVM1302-2MSINSVF1369 FPGA

The XCVM1302-2MSINSVF1369 is a high-performance Versal™ Prime adaptive compute acceleration platform (ACAP) from AMD, engineered for demanding aerospace, automotive, industrial, and telecommunications applications requiring long lifecycle support and proven reliability.

Key Features

  • Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ running at 1.4GHz
  • Dual ARM® Cortex™-R5F with CoreSight™ for real-time processing at 600MHz
  • 70,000 Logic Cells for flexible FPGA fabric implementation
  • Industrial Temperature Range: -40°C to +100°C (TJ)
  • Comprehensive Connectivity: CANbus, Ethernet, PCIe, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Advanced Peripherals: DDR memory controller, DMA, PCIe interface
  • RoHS Compliant for environmental compliance
  • 1369-BGA Package (35mm x 35mm) for high-density integration

Applications

Ideal for aerospace avionics, automotive ADAS and infotainment systems, industrial automation and control, 5G/telecom infrastructure, edge computing, and high-reliability embedded systems requiring adaptive processing and long-term availability.

Authenticity & Documentation

Sourced exclusively from authorized AMD distributors with full manufacturer documentation, traceability, and warranty support. Each unit ships with complete technical specifications and compliance certificates.