AMD XCVM1402-1MSINSVF1369
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 24,501.99 | Dhs. 24,501.99 |
| 15+ | Dhs. 23,728.24 | Dhs. 355,923.60 |
| 25+ | Dhs. 23,212.41 | Dhs. 580,310.25 |
| 50+ | Dhs. 21,922.83 | Dhs. 1,096,141.50 |
| 100+ | Dhs. 19,343.68 | Dhs. 1,934,368.00 |
| N+ | Dhs. 3,868.74 | Price Inquiry |
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AMD Versal™ Prime XCVM1402-1MSINSVF1369 FPGA
The XCVM1402-1MSINSVF1369 is a high-performance adaptive compute acceleration platform (ACAP) from AMD's Versal™ Prime series, engineered for demanding aerospace, automotive, industrial, and telecommunications applications requiring exceptional processing power and long-term availability.
Key Features & Benefits
- 1.2M Logic Cells - Massive programmable logic capacity for complex digital designs and signal processing
- Dual ARM® Cortex®-A72 MPCore™ - High-performance 1.3GHz application processors with CoreSight™ debug
- Dual ARM® Cortex™-R5F - Real-time 600MHz processors for deterministic control tasks
- Advanced Connectivity - PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I2C, UART/USART, MMC/SD/SDIO
- Industrial Temperature Range - Qualified for -40°C to 100°C (TJ) operation in harsh environments
- RoHS Compliant - Meets environmental standards for global deployment
- 1369-BGA Package - Compact 35x35mm footprint with excellent thermal performance
Ideal Applications
This Versal Prime FPGA excels in aerospace flight control systems, automotive ADAS and autonomous driving platforms, industrial automation and robotics, 5G wireless infrastructure, high-speed networking equipment, medical imaging systems, and defense/military embedded computing where reliability, performance, and long lifecycle support are critical.
Sourcing & Documentation: All units are sourced exclusively from authorized AMD distributors with full manufacturer documentation, traceability, and warranty support. Complete datasheets, reference designs, and technical resources available.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ Prime FPGA, 1.2M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA |
| Supplier Device Package | 1369-BGA (35x35) |
| ROHS |  |
XCVM1402-1MSINSVF1369.pdf