AMD XCVM1402-2LSEVSVD1760
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 31,663.56 | Dhs. 31,663.56 |
| 15+ | Dhs. 30,663.64 | Dhs. 459,954.60 |
| 25+ | Dhs. 29,997.04 | Dhs. 749,926.00 |
| 50+ | Dhs. 28,330.53 | Dhs. 1,416,526.50 |
| 100+ | Dhs. 24,997.53 | Dhs. 2,499,753.00 |
| N+ | Dhs. 4,999.51 | Price Inquiry |
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AMD Versal™ Prime XCVM1402-2LSEVSVD1760 FPGA
The XCVM1402-2LSEVSVD1760 is a high-performance Adaptive Compute Acceleration Platform (ACAP) from AMD's Versal™ Prime series, engineered for demanding aerospace, automotive, industrial, and telecommunications applications. This advanced FPGA combines 1.2M logic cells with dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors, delivering exceptional processing power and flexibility for complex system designs.
Key Features & Benefits
- Dual-core ARM Cortex-A72 (1.08GHz) and dual-core ARM Cortex-R5F (450MHz) for heterogeneous processing
- 1.2 Million Logic Cells providing extensive programmable logic resources
- Rich connectivity options: PCIe, DDR, Ethernet, CANbus, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
- Industrial temperature range: 0°C to 100°C (TJ) for reliable operation in harsh environments
- 1760-FCBGA (40x40mm) package optimized for high-density designs
- RoHS compliant with full manufacturer documentation and traceability
Ideal Applications
Perfect for design-in projects requiring high-performance FPGA solutions with integrated processing, including 5G infrastructure, advanced driver assistance systems (ADAS), industrial automation, edge computing, and mission-critical aerospace systems.
Authentic AMD Stock
Sourced from authorized distributors with complete manufacturer documentation, datasheets, and long lifecycle support. Each unit ships in factory-sealed tray packaging with full traceability.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 450MHz, 1.08GHz |
| Primary Attributes | Versal™ Prime FPGA, 1.2M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
| ROHS |  |
XCVM1402-2LSEVSVD1760.pdf