AMD XCVM1502-1MLINFVB1369

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AMD Versal™ Prime XCVM1502-1MLINFVB1369 FPGA

High-performance adaptive compute acceleration platform (ACAP) featuring 1 million logic cells with dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors. Ideal for aerospace, automotive, industrial, medical, and telecommunications applications requiring long lifecycle support and full traceability.

Key Features

  • 1M Logic Cells - Versal™ Prime FPGA architecture with MPU integration
  • Dual-Core Processing - ARM® Cortex®-A72 MPCore™ (1.3GHz) + ARM® Cortex™-R5F (600MHz) with CoreSight™
  • 256KB RAM with DDR, DMA, and PCIe peripherals
  • Comprehensive Connectivity - CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Industrial Temperature Range - Operates from -40°C to 110°C (TJ)
  • 1369-FCBGA Package (35x35mm) for high-density board integration
  • RoHS/REACH Compliant - Full environmental compliance and traceability

Applications

Designed for mission-critical systems in aerospace, defense, automotive ADAS, industrial automation, medical imaging, 5G infrastructure, and high-reliability embedded computing platforms.

Authorized Distributor - Genuine AMD components with full manufacturer traceability, documentation, and long lifecycle commitment.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ Prime
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Primary Attributes Versal™ Prime FPGA, 1M Logic Cells
Operating Temperature -40°C ~ 110°C (TJ)
Grade -
Qualification -
Package / Case 1369-BFBGA, FCBGA
Supplier Device Package 1369-FCBGA (35x35)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY