AMD XCVM1502-2LLEVFVC1760

AMD Versal™ Prime XCVM1502-2LLEVFVC1760 FPGA System-on-Chip

The XCVM1502-2LLEVFVC1760 represents AMD's cutting-edge adaptive compute acceleration platform (ACAP) from the Versal™ Prime series. This high-performance FPGA SoC is specifically engineered for mission-critical applications in aerospace, automotive, telecommunications, and industrial automation where reliability, performance, and adaptability are paramount.

Why Choose the XCVM1502-2LLEVFVC1760?

This advanced FPGA combines programmable logic with powerful embedded processing to deliver exceptional performance for AI/ML acceleration, real-time signal processing, and adaptive hardware acceleration. With authentic AMD sourcing, full manufacturer documentation, and long-term availability commitment, you can design with confidence.

Key Technical Capabilities

• 1 Million Logic Cells - Massive programmable fabric enabling complex digital designs, DSP algorithms, and custom accelerators
• Dual ARM® Cortex®-A72 MPCore™ @ 1.08GHz - High-performance 64-bit application processors with CoreSight™ debug for Linux, RTOS, and bare-metal applications
• Dual ARM® Cortex™-R5F @ 450MHz - Dedicated real-time processors for safety-critical, deterministic workloads and motor control
• 256KB Integrated On-Chip RAM - Low-latency memory for critical data paths and fast context switching
• Comprehensive Connectivity - PCIe Gen4, Gigabit Ethernet, CANbus, USB OTG, DDR4/LPDDR4, SPI, I2C, UART/USART, MMC/SD/SDIO interfaces
• Industrial Temperature Range - Reliable operation from 0°C to 110°C junction temperature for harsh environments
• RoHS Compliant - Meets global environmental and regulatory standards for commercial deployment

Target Applications & Use Cases

Ideal for edge AI/ML inference, embedded vision and image processing, industrial automation and robotics, automotive ADAS and autonomous driving, 5G/6G wireless infrastructure, aerospace avionics and radar systems, high-speed data acquisition, software-defined radio, and adaptive hardware acceleration for compute-intensive workloads.

Package Details & Supply Chain

Supplied in professional-grade 1760-pin FCBGA (Flip-Chip Ball Grid Array) package with 40x40mm footprint. Active production status with long-term availability support directly from AMD authorized distribution. Tray packaging ensures safe handling for automated pick-and-place manufacturing processes.

• XCVM1502-2LLEVFVC1760.pdf