AMD XCVM1802-1LLIVFVC1760
Normaler Preis
Dhs. 54,767.43
Normaler Preis
Dhs. 57,649.91
Verkaufspreis
Dhs. 54,767.43
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 54,767.43 | Dhs. 54,767.43 |
| 15+ | Dhs. 53,037.92 | Dhs. 795,568.80 |
| 25+ | Dhs. 51,884.92 | Dhs. 1,297,123.00 |
| 50+ | Dhs. 49,002.42 | Dhs. 2,450,121.00 |
| 100+ | Dhs. 43,237.43 | Dhs. 4,323,743.00 |
| N+ | Dhs. 8,647.49 | Price Inquiry |
Versand wird beim Checkout berechnet
Request Quote / Inquiry
AMD XCVM1802-1LLIVFVC1760 Versal™ Prime FPGA - High-Performance Adaptive SoC
The AMD XCVM1802-1LLIVFVC1760 is a cutting-edge Versal™ Prime series adaptive SoC combining FPGA fabric with embedded processing, delivering exceptional performance for aerospace, automotive, industrial, medical, and telecom applications requiring long-term availability and full traceability.
Key Features & Benefits
- 1.9M Logic Cells - Massive programmable logic capacity for complex designs
- Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ - High-performance 1GHz application processing
- Dual ARM® Cortex™-R5F with CoreSight™ - 400MHz real-time processing for deterministic control
- 256KB Integrated RAM - On-chip memory for low-latency operations
- Rich Connectivity - CANbus, Ethernet, PCIe, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
- Industrial Temperature Range - Qualified for -40°C to 100°C (TJ) operation
- 1760-FCBGA Package - 40x40mm form factor for high-density board designs
- RoHS/REACH Compliant - Meets environmental regulations for global markets
Applications
Ideal for advanced embedded systems in aerospace & defense, automotive ADAS, industrial automation, medical imaging, 5G infrastructure, and high-reliability computing platforms requiring adaptive processing, hardware acceleration, and long lifecycle support.
Authorized Distributor - Full manufacturer traceability, original documentation, and long lifecycle commitment. Contact us for volume pricing, lead times, and technical support.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ Prime FPGA, 1.9M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
| ROHS |  |
XCVM1802-1LLIVFVC1760.pdf
×