AMD XCVM1802-1MSIVSVD1760
Normaler Preis
Dhs. 39,440.02
Normaler Preis
Dhs. 41,515.80
Verkaufspreis
Dhs. 39,440.02
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 39,440.02 | Dhs. 39,440.02 |
| 15+ | Dhs. 38,194.54 | Dhs. 572,918.10 |
| 25+ | Dhs. 37,364.22 | Dhs. 934,105.50 |
| 50+ | Dhs. 35,288.43 | Dhs. 1,764,421.50 |
| 100+ | Dhs. 31,136.85 | Dhs. 3,113,685.00 |
| N+ | Dhs. 6,227.37 | Price Inquiry |
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AMD Versal™ Prime XCVM1802-1MSIVSVD1760 FPGA
The XCVM1802-1MSIVSVD1760 is a high-performance adaptive compute acceleration platform (ACAP) from AMD's Versal™ Prime series, combining FPGA fabric with embedded processing for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.
Key Features
- 1.9M Logic Cells – Massive programmable logic capacity for complex designs
- Dual ARM® Cortex®-A72 MPCore™ (1.3GHz) + Dual ARM® Cortex™-R5F (600MHz) – Heterogeneous processing with CoreSight™ debug
- 256KB RAM with DDR, DMA, and PCIe peripherals
- Rich Connectivity – CANbus, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Industrial Temperature Range – Operates reliably from -40°C to 100°C (TJ)
- 1760-FCBGA Package (40x40mm) – High-density ball grid array for advanced board designs
- RoHS Compliant – Meets environmental and regulatory standards
Applications
Ideal for high-reliability systems requiring long lifecycle support: embedded vision, 5G infrastructure, radar/lidar processing, motor control, test & measurement, and software-defined radio.
Full Technical Specifications
Authorized Distributor – Full traceability, original manufacturer documentation, and long-term availability guarantee.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ Prime FPGA, 1.9M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
| ROHS |  |
XCVM1802-1MSIVSVD1760.pdf
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