AMD XCVM1802-2MLEVSVD1760
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 47,323.26 | Dhs. 47,323.26 |
| 15+ | Dhs. 45,828.82 | Dhs. 687,432.30 |
| 25+ | Dhs. 44,832.55 | Dhs. 1,120,813.75 |
| 50+ | Dhs. 42,341.85 | Dhs. 2,117,092.50 |
| 100+ | Dhs. 37,360.46 | Dhs. 3,736,046.00 |
| N+ | Dhs. 7,472.09 | Price Inquiry |
Request Quote / Inquiry
AMD Versal™ Prime XCVM1802-2MLEVSVD1760 FPGA
The XCVM1802-2MLEVSVD1760 is a high-performance System-on-Chip (SoC) FPGA from AMD's Versal™ Prime series, engineered for demanding aerospace, automotive, industrial, and telecommunications applications. This advanced FPGA combines adaptive computing with embedded processing power, delivering exceptional performance and flexibility for next-generation system designs.
Key Features & Benefits
- 1.9 Million Logic Cells - Massive programmable logic capacity for complex designs
- Dual ARM® Cortex®-A72 MPCore™ - High-performance 1.4GHz application processors with CoreSight™ debug
- Dual ARM® Cortex™-R5F - Real-time 600MHz processors for deterministic control with CoreSight™
- 256KB Integrated RAM - On-chip memory for fast data access
- Rich Connectivity - CANbus, Ethernet, PCIe, USB OTG, I2C, SPI, UART, MMC/SD/SDIO interfaces
- Advanced Peripherals - DDR memory controller, DMA, PCIe for high-bandwidth applications
- Industrial Temperature Range - Operates reliably from 0°C to 100°C (TJ)
- RoHS Compliant - Environmentally friendly, lead-free manufacturing
- Active Production Status - Long-term availability guaranteed
Ideal Applications
Perfect for high-density FPGA solutions in aerospace systems, automotive ADAS and infotainment, industrial automation and control, 5G telecommunications infrastructure, edge computing, and AI/ML acceleration at the edge.
Package & Delivery
Supplied in professional tray packaging with the compact 1760-FCBGA (40x40mm) form factor, this component is ready for integration into your production workflow. Authentic AMD product with full manufacturer documentation and traceability.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.4GHz |
| Primary Attributes | Versal™ Prime FPGA, 1.9M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
| ROHS |  |
XCVM1802-2MLEVSVD1760.pdf