AMD XCZU11EG-1FFVC1156E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 14,667.74 | Dhs. 14,667.74 |
| 15+ | Dhs. 14,204.54 | Dhs. 213,068.10 |
| 25+ | Dhs. 13,895.75 | Dhs. 347,393.75 |
| 50+ | Dhs. 13,123.76 | Dhs. 656,188.00 |
| 100+ | Dhs. 11,579.79 | Dhs. 1,157,979.00 |
| N+ | Dhs. 2,315.96 | Price Inquiry |
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AMD XCZU11EG-1FFVC1156E Zynq UltraScale+ MPSoC FPGA
The AMD XCZU11EG-1FFVC1156E is a high-performance Zynq® UltraScale+™ MPSoC (Multiprocessor System-on-Chip) combining FPGA fabric with embedded processing capabilities. This engineering-grade device delivers exceptional computational power and flexibility for demanding aerospace, automotive, industrial automation, and telecommunications applications.
Key Features
- 653K+ Logic Cells - Extensive FPGA resources for complex digital designs
- Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - High-performance 64-bit application processing at 1.2GHz
- Dual ARM® Cortex™-R5 with CoreSight™ - Real-time processing for safety-critical functions at 600MHz
- ARM Mali™-400 MP2 GPU - Graphics and video processing acceleration at 500MHz
- 256KB RAM - Integrated on-chip memory
- Industrial Temperature Range - Operates reliably from 0°C to 100°C (TJ)
- RoHS Compliant - Meets environmental standards for global markets
Connectivity & Peripherals
Comprehensive I/O support including CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, plus DMA and watchdog timer peripherals for robust system integration.
Applications
Ideal for advanced driver assistance systems (ADAS), industrial machine vision, 5G wireless infrastructure, medical imaging equipment, aerospace avionics, and high-performance embedded computing platforms requiring both processing power and FPGA flexibility.
Package & Availability
Supplied in 1156-FCBGA (35x35mm) package, tray packaging. Active production status with long-term availability commitment from authorized distributors.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| ROHS |  |
XCZU11EG-1FFVC1156E.pdf