AMD XCZU11EG-1FFVF1517E
Normaler Preis
Dhs. 16,051.31
Normaler Preis
Dhs. 16,896.12
Verkaufspreis
Dhs. 16,051.31
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 16,051.31 | Dhs. 16,051.31 |
| 15+ | Dhs. 15,544.43 | Dhs. 233,166.45 |
| 25+ | Dhs. 15,206.51 | Dhs. 380,162.75 |
| 50+ | Dhs. 14,361.70 | Dhs. 718,085.00 |
| 100+ | Dhs. 12,672.09 | Dhs. 1,267,209.00 |
| N+ | Dhs. 2,534.42 | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC EG - XCZU11EG-1FFVF1517E
The XCZU11EG-1FFVF1517E is a high-performance System-on-Chip (SoC) from AMD's Zynq® UltraScale+™ MPSoC EG series, combining advanced processing capabilities with programmable logic for demanding embedded applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.
Key Features
- Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ for high-performance application processing
- Dual ARM® Cortex™-R5 with CoreSight™ for real-time control
- ARM Mali™-400 MP2 graphics processing unit
- 653K+ Logic Cells FPGA fabric for custom hardware acceleration
- Processing speeds: 500MHz, 600MHz, and 1.2GHz
- 256KB RAM for embedded applications
- Industrial temperature range: 0°C to 100°C (TJ)
- RoHS compliant for environmental standards
Connectivity & Peripherals
Comprehensive I/O support including CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, plus DMA and WDT peripherals for flexible system integration.
Package Information
Supplied in 1517-FCBGA (40x40mm) package format, tray packaging, active part status with full manufacturer support and long lifecycle commitment.
Applications
- Aerospace & Defense Systems
- Automotive ADAS & Infotainment
- Industrial Automation & Robotics
- Medical Imaging & Diagnostics
- 5G Wireless Infrastructure
- High-Performance Embedded Computing
Authorized distributor | Full traceability | Long lifecycle support | RoHS/REACH compliant | Technical documentation available
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FCBGA (40x40) |
| ROHS |  |
XCZU11EG-1FFVF1517E.pdf
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