AMD XCZU11EG-2FFVC1760I
Normaler Preis
Dhs. 29,446.68
Normaler Preis
Dhs. 30,996.51
Verkaufspreis
Dhs. 29,446.68
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 29,446.68 | Dhs. 29,446.68 |
| 15+ | Dhs. 28,516.79 | Dhs. 427,751.85 |
| 25+ | Dhs. 27,896.86 | Dhs. 697,421.50 |
| 50+ | Dhs. 26,347.03 | Dhs. 1,317,351.50 |
| 100+ | Dhs. 23,247.38 | Dhs. 2,324,738.00 |
| N+ | Dhs. 4,649.48 | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC EG XCZU11EG-2FFVC1760I
The XCZU11EG-2FFVC1760I is a high-performance System-on-Chip (SoC) from AMD's Zynq® UltraScale+™ MPSoC EG family, combining programmable logic with processing power for demanding aerospace, automotive, industrial, and telecommunications applications.
Key Features
- Processing Power: Quad ARM® Cortex®-A53 MPCore with CoreSight™ (1.3GHz), Dual ARM® Cortex™-R5 with CoreSight™ (533MHz/600MHz), ARM Mali™-400 MP2 GPU
- FPGA Fabric: 653,000+ logic cells for custom hardware acceleration and parallel processing
- Memory: 256KB integrated RAM for real-time processing
- Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI interfaces
- Industrial Grade: Extended temperature range -40°C to +100°C (TJ) for harsh environments
- Package: 1760-pin FCBGA (42.5mm × 42.5mm) for high I/O density
- RoHS Compliant: Environmentally responsible manufacturing
Applications
Ideal for advanced embedded systems requiring both programmable logic and high-performance processing: aerospace flight control, automotive ADAS, industrial automation, 5G wireless infrastructure, medical imaging, and video processing systems.
Authentic Sourcing & Documentation
Sourced exclusively from authorized AMD distributors with full manufacturer documentation and traceability. Long-term availability commitment for mission-critical designs.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| ROHS |  |
XCZU11EG-2FFVC1760I.pdf
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