AMD XCZU19EG-1FFVC1760I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 28,668.15 | Dhs. 28,668.15 |
| 15+ | Dhs. 27,762.84 | Dhs. 416,442.60 |
| 25+ | Dhs. 27,159.30 | Dhs. 678,982.50 |
| 50+ | Dhs. 25,650.45 | Dhs. 1,282,522.50 |
| 100+ | Dhs. 22,632.75 | Dhs. 2,263,275.00 |
| N+ | Dhs. 4,526.55 | Price Inquiry |
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AMD XCZU19EG-1FFVC1760I Zynq® UltraScale+™ MPSoC EG
The AMD XCZU19EG-1FFVC1760I is a high-performance System-on-Chip (SoC) combining advanced processing capabilities with extensive FPGA logic resources. This industrial-grade device is engineered for demanding aerospace, automotive, industrial automation, and telecommunications applications requiring long-term availability and proven reliability.
Key Features
- Heterogeneous Processing Architecture: Quad ARM® Cortex®-A53 MPCore™ (up to 1.2GHz), Dual ARM® Cortex™-R5 (up to 600MHz), and ARM Mali™-400 MP2 GPU
- Massive FPGA Resources: 1,143,000+ programmable logic cells for custom acceleration and I/O interfacing
- Industrial Temperature Range: -40°C to +100°C (TJ) for harsh-environment deployment
- Rich Connectivity: CANbus, Ethernet, USB OTG, PCIe, multiple serial interfaces (UART, SPI, I²C), and MMC/SD/SDIO
- Compact High-Density Package: 1760-pin FCBGA (42.5mm × 42.5mm)
- RoHS Compliant: Meets environmental and regulatory standards for global markets
Applications
Ideal for advanced driver-assistance systems (ADAS), industrial machine vision, 5G wireless infrastructure, avionics, medical imaging, and high-performance embedded computing platforms requiring deterministic real-time processing alongside adaptive hardware acceleration.
Sourcing & Documentation
Sourced exclusively from authorized AMD distributors with full traceability. Complete datasheets, reference designs, and technical documentation available from AMD. Long lifecycle commitment ensures multi-year design-in confidence.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| ROHS |  |
XCZU19EG-1FFVC1760I.pdf