AMD XCZU19EG-3FFVD1760E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 49,564.23 | Dhs. 49,564.23 |
| 15+ | Dhs. 47,999.03 | Dhs. 719,985.45 |
| 25+ | Dhs. 46,955.57 | Dhs. 1,173,889.25 |
| 50+ | Dhs. 44,346.93 | Dhs. 2,217,346.50 |
| 100+ | Dhs. 39,129.65 | Dhs. 3,912,965.00 |
| N+ | Dhs. 7,825.93 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 667MHz, 1.5GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| ROHS |  |
AMD XCZU19EG-3FFVD1760E - Zynq® UltraScale+™ MPSoC EG Series
The XCZU19EG-3FFVD1760E is a high-performance System-on-Chip (SoC) combining advanced FPGA fabric with embedded processing capabilities. This device features a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2 graphics processing unit, delivering exceptional computational power for demanding applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.
Key Features & Benefits
- Advanced Processing Architecture: Multi-core ARM processing with 1143K+ logic cells for complex system integration
- High-Speed Performance: Operating speeds up to 1.5GHz with 256KB integrated RAM
- Comprehensive Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
- Industrial-Grade Reliability: Operating temperature range 0°C to 100°C (TJ), RoHS/REACH compliant
- Flexible Integration: 1760-FCBGA package (42.5x42.5mm) with full traceability
- Active Production Status: Long lifecycle commitment for design-in confidence
Ideal Applications
Perfect for high-reliability embedded systems requiring FPGA programmability combined with ARM processing power: advanced driver assistance systems (ADAS), industrial machine vision, 5G wireless infrastructure, medical imaging equipment, aerospace avionics, and high-performance computing platforms.
Compliance & Quality Assurance: This component is supplied with full manufacturer traceability, RoHS and REACH compliance certification, and backed by our commitment to long lifecycle availability for critical applications.
XCZU19EG-3FFVD1760E.pdf