AMD XCZU19EG-3FFVE1924E
Normaler Preis
Dhs. 44,720.31
Normaler Preis
Dhs. 47,074.01
Verkaufspreis
Dhs. 44,720.31
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 44,720.31 | Dhs. 44,720.31 |
| 15+ | Dhs. 43,308.09 | Dhs. 649,621.35 |
| 25+ | Dhs. 42,366.61 | Dhs. 1,059,165.25 |
| 50+ | Dhs. 40,012.91 | Dhs. 2,000,645.50 |
| 100+ | Dhs. 35,305.51 | Dhs. 3,530,551.00 |
| N+ | Dhs. 7,061.10 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 667MHz, 1.5GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1924-BBGA, FCBGA |
| Supplier Device Package | 1924-FCBGA (45x45) |
| ROHS |  |
AMD Zynq® UltraScale+™ MPSoC EG - XCZU19EG-3FFVE1924E
The XCZU19EG-3FFVE1924E is a high-performance System-on-Chip (SoC) from AMD's Zynq® UltraScale+™ MPSoC EG series, combining advanced processing capabilities with extensive FPGA logic resources. This device integrates a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2 graphics processing unit, delivering exceptional computational power for demanding embedded applications.
Key Features & Benefits:
- Powerful Multi-Core Processing: Quad ARM Cortex-A53 running at up to 1.5GHz plus dual Cortex-R5 cores for real-time control
- Massive FPGA Resources: 1143K+ logic cells for custom hardware acceleration and parallel processing
- Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
- Industrial Temperature Range: 0°C to 100°C (TJ) for reliable operation in harsh environments
- Compact High-Density Package: 1924-FCBGA (45x45mm) for space-constrained designs
- RoHS Compliant: Meets environmental standards for global deployment
Ideal Applications:
Perfect for aerospace, automotive, industrial automation, medical imaging, telecommunications infrastructure, and advanced driver assistance systems (ADAS) requiring high-reliability components with long lifecycle support.
XCZU19EG-3FFVE1924E.pdf
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